RDP-23FV

Engineered for the harshest environments, the RDP-23FV is CesiumAstro’s high-performance digital processor designed to meet the demands of next-generation aerospace missions. Built around Xilinx Versal Prime (1802) and Versal AI Core (1902) FPGAs, the RDP-23FV delivers powerful computing, AI-driven processing, and reconfigurable flexibility—all in a compact, flight-ready package.

Key Features

Compact, Lightweight Design

Footprint: VITA 78.0-2022 3U SpaceVPX standard
(7.00 in. X 3.94 in. X 0.99 in).
Weight: 541.7 g, ideal for space-constrained missions.

High-Performance Computing

Processing Power: Dual-Core Arm Cortex-A72 and Dual-Core Arm Cortex-R5F processors with 256 KB on-chip memory (ECC).
Memory: 8 GB DDR4 with ECC and up to 8 Gbit MRAM.

Power Efficiency

Power Modes: Operational power consumption of 25 to 30 W, with 40 W max. and a 20 W standby mode.

Environmental Resilience

Temperature Range: Operational from -24°C to 61°C; survival from -40°C to 85°C.
Radiation Tolerance: Designed to withstand 20 krad (Si) TID and DSEE up to 37 MeV·cm²/mg.
Vibration and Shock: Qualified for 14.1 Grms vibration and 1400 G shock in line with NASA and SpaceX standards.

Mission-Class Longevity

Orbit and Duration: Optimized for LEO, 1000 km, 7 years.
MEO/GEO parts plans available.

Modular Configurations for Every Mission

The RDP-23FV adapts to your mission needs through a modular mezzanine architecture. All mezzanine options share a common Board Support Package (BSP), dramatically reducing development time and streamlining integration.

Software-Defined Radio (SDR)

Expand the RDP’s functionality with CesiumAstro’s RF mezzanine, enabling advanced software-defined radio capabilities for high-performance communication.

Single-Board Computer (SBC)

Attach a memory mezzanine to transform the RDP into a powerful single-board computer, ready for data-intensive operations.

High-Powered Switch

Integrate an I/O mezzanine to convert the RDP into a robust, high-powered switch for seamless connectivity across systems.

RDP-23FV Development Kit

The RDP-23FV development kit includes an open-frame chassis for easy troubleshooting, a COTS power supply and air-cooled chassis, and a COTS power and ground backplane with RTM support. The kit comprises the RDP EM card slice, a 3U SpaceVPX power and ground platform, a universal rear transition module, and a board support package for custom software and firmware development.

Additional Resources

A full suite of documentation is available to support integration of RDP-23FV Reconfigurable Digital Processor into your mission. Our team stands ready to support you. Contact us for technical specifications or to discuss your programming challenges.

Email Us

Reconfigurable Digital Processor